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KAIYAN adopts two mature manufacturing technologies to match different order volumes.
For low-volume prototype custom orders, we use chemical etching and sheet metal bending, requiring no expensive moulds and shortening sampling lead time.
For bulk orders exceeding 2,000 pieces, products are manufactured via precision stamping tooling. Compared with chemical etching, stamping greatly reduces unit cost and ensures stable mass output.
Available raw materials: nickel silver, tinplate, stainless steel, phosphor bronze, brass.
All dimensions, material thickness, cover structure and mounting method can be customized strictly according to customer drawings or physical samples.
| Material | Machining Precision (Tolerance) | Coplanarity for SMT Pad | Shielding Effectiveness @2.4GHz | Application Notes |
|---|---|---|---|---|
| Nickel Silver (C7521) | ★★★★★
Stamping ±0.03~±0.05mm; Etching ±0.01mm, controllable springback |
★★★★★
Low warpage after bending, coplanarity ≤0.08mm easily achieved |
★★★★★
SE ≥55~65dB, non-magnetic |
First choice for Bluetooth, Wi-Fi & RF IoT modules |
| Tinplate | ★★★★
±0.04~±0.06mm; thin sheets prone to minor deformation |
★★★★
Good rigidity with slight bending springback |
★★★
SE≈38~48dB, lower conductivity |
Cost-sensitive basic shielding, not recommended for high-frequency RF |
| Stainless Steel 304 | ★★★★
Stable tolerance but work hardening occurs |
★★★
High springback; harder to control coplanarity for ultra-thin stock |
★★★
SE≈30~42dB, weak high-frequency electric field shielding |
For corrosion resistance & structural protection |
| Phosphor Bronze | ★★★★★
Ideal for designs with spring clips |
★★★★
Strong elasticity; process tuning needed for complex bends |
★★★★
SE≈50~60dB, excellent conductivity |
Shield cans with removable lids & spring contacts |
| Brass | ★★★★
Good formability |
★★★★
Stable flatness |
★★★★
SE≈48~58dB, prone to oxidation |
Low-cost low-frequency shielding, avoid premium RF circuits |
We supply multiple surface treatments to satisfy different working scenarios:
✅ Tin Plating — Good solderability, cost-effective
✅ Nickel Plating — Anti-oxidation, stable conductivity
✅ Gold Plating — Excellent corrosion resistance & high-frequency performance
Our engineering team provides professional DFM analysis at the early design stage. We help optimise shielding structure, avoid manufacturing defects, reduce modification costs and accelerate your product development progress.
RF shield cans are designed to suppress EMI and protect sensitive PCB circuits.
Common applications: Bluetooth modules, Wi-Fi communication units, RF transceiver modules, communication equipment, automotive electronics, medical devices and IoT products.
